Solder paste in elctronics packaging : technology and applications in surface mount, hybrid circuits and component assembly
av Jennie S. Hwang
Bok Språk ikke angitt 1989
| Utgitt | New York : Van Nostrand Reinhold , 1989
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|---|---|
| Omfang | 456s.
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| Emner | Printed circuits - Design and construction
Solder pastes Surface mount technology trykte strømkretser komponentmontasje lodding integrerte kretser |
| ISBN | 0442207549
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