Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

John H. Lau, Yi-Hsin Pao
Bok · Engelsk · 1997

Utgitt	New York : McGraw-Hill , c1997
Omfang	XXI, 408 s. : ill.
Emner	Microelectronic packaging - Reliability Multichip modules (Microelectronics) - Testing Solder and soldering - Testing
ISBN	0070366489