On packaging of MEMS : simulation of transfer moulding and packaging stress and their effect on a family of piezo-resistive pressure sensors
by Rudolf H. Krondorfer
Bok Engelsk 2003
| Utgitt | Trondheim : Norwegian University of Science and Technology, Department of Engineering Design and Materials, Faculty of Engineering Science and Technology , [2003]
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| Omfang | XII, 148 s. : ill.
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| Opplysninger | Avhandling (dr. ing.) - Norges teknisk-naturvitenskapelige universitet, Trondheim, 2004
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| ISBN | 8247156687
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