Thermal stress and strain in microelectronics packaging
edited by John H. Lau
Bok Engelsk 1993
| Utgitt | New York : Van Nostrand Reinhold , c1993
|
|---|---|
| Omfang | xxii, 883 p. : ill.
|
| Opplysninger | Includes bibliographical references and index.
|
| Emner | |
| ISBN | 0442010583
|
