Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991
sponsored by the Applied Mechanics Division, ASME, the Electronic Packaging Division, ASME ; edited by W. T. Chen, P. Engel, W. E. Jahsman
Bok Engelsk 1991 American Society of Mechanical Engineers
| Utgitt | New York : The Society , c1991
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|---|---|
| Omfang | v, 153 s. : ill.
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| Emner | |
| ISBN | 0791808963
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