Wire bonding in microelectronics : materials, processes, reliability, and yield
George G. Harman
Bok Engelsk 1997
| Utgitt | New York : McGraw-Hill , c1997
|
|---|---|
| Omfang | XIV, 290 s. : ill.
|
| Utgave | 2nd ed.
|
| Opplysninger | Rev. utg. av: Reliability and yield problems of wire bonding in microelectronics. 1989.
|
| Emner | |
| ISBN | 0070326193
|
