Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania USA, 24-28 April 1989
edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International
Bok Språk ikke angitt 1989 ASM International Electronic Materials and Processing Congress
| Utgitt | Metals Park, Ohio : ASM International , c1989
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| Omfang | XII, 479 s. : ill.
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| Emner | |
| ISBN | 0871703599
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