8 treff

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
John H. Lau, Yi-Hsin Pao
Bok Engelsk 1997
Flip chip technologies
John H. Lau, editor
Bok Engelsk 1996
Ball grid array technology
John H. Lau, editor
Bok Engelsk 1995
Chip on board technologies for multichip modules
edited by John H. Lau
Bok Engelsk 1994
Handbook of fine pitch surface mount technology
edited by John H. Lau
Bok Engelsk 1994
Thermal stress and strain in microelectronics packaging
edited by John H. Lau
Bok Engelsk 1993
Handbook of tape automated bonding
edited by John H. Lau
Bok Engelsk 1992
Solder joint reliability : theory and applications
edited by John H. Lau
Bok Engelsk 1991