Multichip modules : systems advantages, major constructions, and materials technologies

edited by R. Wayne Johnson, Robert K. F. Teng, John W. Balde
Bok Engelsk 1991


Utgitt	New York : IEEE Press , c1991
Omfang	ix, 603 s. : ill.
Emner	Electronic packaging Microelectronic packaging VLSI
ISBN	087942267X

Biblioteksøk