Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability

[edited by] Michael Pecht
Bok · Engelsk · 1994

Utgitt	New York : Wiley , c1994
Omfang	XXXI, 426 s. : ill.
Opplysninger	"A Wiley-Interscience publication."
Emner	Electronic packaging - Design Hybrid integrated circuits - Design and construction Multichip modules (Microelectronics) - Design and construction Elektronikk - Montering Integrerte kretser - Produksjon
ISBN	0471594466